Aug 10 , 2024
*For surface mounted applications
*Low profile package
*Glass Passivated Chip Junction
*Superfast reverse recoverytime
*Lead free in comply with EUROHS 2011/65/EU directives
*Case: SMA
*Terminals: Solderable per MIL-STD-750, Method 2026
*Approx. Weight: 0.055g/0.002oz