Aug 10 , 2024
For surface mounted applications
Low profile package
Glass Passivated Chip Junction
ldeal for automated placement
Fast reverse recovery time
Lead free in comply with EU RoHS 2011/65/EU directives
Case: SOD.123FL
Terminals: Solderable per MIL-STD-750, Method 2026
Approx, Weight:15mg 0.000530z
