Jul 09 , 2024
For surface mounted applications
Low profile package
Glass Passivated Chip Junction
ldeal for automated placement
Fast reverse recovery time
Lead free in comply with EU RoHS 2011/65/EU directives
Case: SOD-123FL
Terminals: Solderable per MIL-STD-750, Method 2026
Approx. Weight: 15mg 0.00053oz
