Aug 10 , 2024
For surface mounted applications
Low profile package
Glass Passivated Chip Junction
Easy to pick and place
Fastreverserecovery time
Lead free in comply with EU RoHS 2011/65/EU directives
Case: SMAF
Terminals: Solderable per MIL-STD-750, Method 2026
Approx. Weight: 27mg/0.00095oz
