SW20N20D
General Description:This power MOSFET is produced with advanced technology of SAMWIN.This technology enable the power MOSFET to have better characteristics, including fast switching time, low on resistance, low gate charge and especially xcellent avalanche characteristics.
SW5N25K3
FeaturesHigh ruggednessLow RDS(ON) (Typ 0.5Ω)@VGS=10VLow Gate Charge (Typ 3.6nC)Improved dv/dt Capability100% Avalanche TestedApplication: Charger, LED, PC PowerGeneral DescriptionThis power MOSFET i...
MBR20100DS
SCHOTTKY BARRIER RECTIFIERSReverse Voltage-100 VForward Current-20 AFEATURESHigh current capabilityLow forward voltage dropLow power loss, high efficiencyHigh surge capabilityHigh temperature solderin...
1W SIP4 Constant Voltage Non Steady Voltage
3W SIP8 Wide Pressure
6W DIP Wide Voltage
EV03 MOTOR CONTROLLERS
EV-03 AC Motor Controller is based on TI’s latest generation 32-bit MCU, offering features such as high control precision, fast torque response, smooth start-up, safety and reliability, stability and efficiency, low noise, and simple installation. Supports functions such as brake power cut-off, regenerative braking, E-ABS, current limiting, cruise control, wheel rotation alarm, self-learning, single-wire communication, one-click repair, hill descent control, TCS (Traction Control System), nitrogen mode, and anti-slip break. Provides comprehensive protection functions such as overheat, overvoltage, undervoltage, overcurrent, short circuit, overspeed, communication failure, position signal failure, temperature detection signal failure, etc.
KBP2005G~KBP210G
FEATURESRating to 1000V PRVIdeal for printed circuit boardReliable low cost construction utilizing molded plastic techniqueThe plastic material has UL flammability classification 94V#DMECHANICAL DATAP...
S3ABF~S3MBF
FEATURESFor surface mounted applicationsLow profile packageGlass Passivated Chip JunctionEasy to pick and placeLead free in comply with EU RoHS 2011/65/EU directivesMECHANICAL DATACase: SMBFTerminals:...
US3ABF~US3MBF
FEATURESFor surface mounted applicationsLow profile packageGlass Passivated Chip JunctionEasy to pick and placeHigh efficiencyLead free in comply with EU RoHS 2011/65/EU directivesMECHANICAL DATACase:...
RS3ABF~RS3MBF
FEATURESFor surface mounted applicationsLow profile packageGlass Passivated Chip JunctionEasy to pick and placeFastreverse recovery timeLead free in comply with EU RoHS 2011/65/EU directivesMECHANICAL...
ES3AF~ES3JF
FEATURESFor surface mounted applicationsLow profile packageGlass Passivated Chip JunctionSuperfast reverse recovery timeLead free in comply with EU RoHS 2011/65/EU directivesMECHANICAL DATACase: SMAFT...
MM3Z2V0~MM3Z75
FEATURESTotal power dissipation: Max. 300mw.Wide zenerreverse voltage range 2.0V to 75V.Small plastic package suitable for surface mounted designTolerance approximately+5%MECHANICAL DATACase: SOD-323T...
SMBJ Series
FEATURESFor surface mounted applications in order to optimize board space.Low profile packageGlass passivated junctionLow inductancePlastic package has Underwriters Laboratory FlammabilityMECHANICAL D...
ESD3Z5V0-ESD3Z12
General DescriptionThe ESD3Z5V0 Seriesis designed to protect voltage sensitive components from ESD and transient voltage events.Excellent clamping capability, low leakage, and fast response time, make...
